Emerging Technology Trends





PROFILE
PUBLICATIONS
DOWNLOADS
CASE STUDIES
FUTURE 50
MULTIMEDIA
LINKS
CONTACT
HOME


MEMS/MOEMS Packaging


Area Array Packaging Handbook


Handbook of Flexible Circuits


Polymer Thick Film


BOOKS

  • Author: Industrial Forensics Strategic Approach to Problem Solving, TBD (manuscript complete), 2005-2006

  • Author: MEMS/MOEMS Packaging, McGraw-Hill, NY, published July 2005

  • Editor/Author: Area Array Package Design: Techniques in High Density Electronics , McGraw-Hill, NY, published November 2003

  • Editor/Author: Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free, McGraw-Hill, NY, published November 2003

  • Editor/Author: Area Array Packaging Processes: for BGA, Flip Chip, and CSP , McGraw-Hill, NY, published November 2003

  • Author/Chapter: "Flip Chips", Chip-Scale Packaging for Modern Electronics, J. Fjelstad, R. Ghaffarian, Y. Kim, Electrochemical Publications, LTD, Isle of Man, 2003

  • Author/Chapter: "Photonics", McGraw-Hill Yearbook of Science and Technology 2002, McGraw-Hill, NY 2002

  • Author/Chapter: "Printed Circuit History and Overview", Electronic Assembly Fabrication, C. Harper, McGraw-Hill, NY, 2002

  • Editor/Author: Area Array Packaging Handbook: Manufacturing and Assembly, McGraw-Hill, NY, Nov. 2001

  • Author/Chapter: "Conductive Adhesives as a Lead-Free Alternative", Environment Friendly Electronics: Lead-Free Technology, J. Hwang, Electrochemical Publications, London, 2001

  • Coauthor: Surface Mount Technology Basics, Seimens, Munich, Germany, 2001

  • Author/Chapter: "Flip Chip Technology: Materials and Processes for Next Generation of High-Performance Electronics", Electronic Packaging and Interconnect Handbook, C. Harper, McGraw-Hill, NY, 2000

  • Author/Chapter: "Introduction to Conductive Adhesives", Conductive Adhesives for Electronics Packaging, J. Liu, Electrochemical Publishers Ltd. UK, 2000

  • Author: Polymer Thick Film: Today's emerging technology for a clean environment tomorrow, Springer, NY, May 1, 1995

  • Author/Chapter: "Surface Tension and Rheology", Handbook of Coating Technology, Marcel-Dekker, NY 1991

  • Editor/Author: Handbook of Flexible Circuits, Van Nostrand Reinhold, NY, 1992

  • Author/Chapter: "Screen Printing", Plastic Finishing and Decorating, pp. 152-172, Van Nostrand Reinhold, NY, 1986

  • Author/Chapter: "Nylon Flammability", Advances in Flame Retardants, Vol. 5, pp. 165-181, 1975



  • PUBLICATIONS & PRESENTATIONS FULL REFERENCE LIST: 1969 - PRESENT




    PROFILE   PUBLICATIONS   DOWNLOADS
    CASE STUDIES   FUTURE 50   MULTIMEDIA
    LINKS   CONTACT   HOME   TOP   BACK

    ET-Trends LLC, 16334 Patriot Way, West Greenwich, RI 02817

    Copyright ET-TRENDS, ALL RIGHTS RESERVED
    REPRODUCTION WITHOUT PERMISSION IS PROHIBITED

    The Hitchhiker's Guide