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Alien MEMS


Cables Cut


Carbon Nanotube


Chip on Board Flex



Nano Spheres


Smart Relay

FEATURED DOWNLOADS


Electronics Report 2007

Energy Alternatives Report 2007

Flat Panel Displays - Photonics Newsletter 2007

Printing Electronics Report 2007

RFID News 2007

Semicon, Packaging & Assembly Report 2007


Technical Papers and Articles

  • Area Array Packaging - Then and Now

  • The Future of Technology - 50 Years Ahead

  • The Sci-Fi Future of Medicine ... the Next 50 Years

  • The Alchemy of Nanotech

  • The Alchemy of Nanotech - Part II

  • Milestones in Packaging (notes)

  • Onward and Upward - from Pyramids to Blocks

  • The Enlightened Chip

  • The Future of Packaging

  • Big Nano Success Stories

  • The Sci-Fi Future of Medicine ... the Next 50 Years

  • The Future of Technology - 50 Years Ahead

  • Thermoplastic Injection Molding: New Packages and 3D Circuits

  • Thermoplastic Electronic Packaging: Low Cost High Versatility

  • Heat Sink Materials

  • MEMS in Medicine

  • MEMS Packaging Update

  • Injection Molded & Micro Fabrication Electronic Packaging

  • Packaging Medical Electronics Products

  • Low Ball BGA: A New Concept in Thermoplastic Packaging

  • The Alchemy of Nanotechnology

  • The New Convergence

  • Time To Consider Thermoplastic Materials for Electronic Packaging

  • Underfill Update: Materials and Processes

  • Press Release: Wafer-Level Die Stacking and Assembly

  • Device/Package/PCB/System Technology Categories

  • Plastic Hermetic Packages for MEMS, MOEMS & Optoelectronic Devices?

  • Wafer-Level Flux-Underfill: Underflip!

  • MEMS & MOEMS Packaging Challenges

  • Overview of New Packages, Materials and Processes

  • RFID Tags Enabled by Flip Chip

  • The Circuit Centennial

  • Managing MOEMS

  • Newest Micropackaging Concepts Including MEMS & Photonics

  • Conductive Adhesives - The High Tech Solution in Medical Electronics

  • Flip Chip Assembly with Conductive Adhesives

  • Getters Molecular Scavengers for Packaging

  • Flex-Based Packaging Solutions from CSPs to MEMS

  • Materials and Processes for MR and GMR Heads and Assemblies

  • Ultra-High Density Magnetic Heads

  • Reworkable Packaging Materials Die Attach & Underfills

  • The Great Underfill Race

  • Will Flip Chip Become the Ultimate CSP?

  • The First 147 Years of OptoElectronics

  • MEMS Challenge: Can This Technology Catch the Internet Lightwave?

  • Interposer Multilayer Circuitry

  • Nano-Hoax?

  • The Chemistry & Physics of Underfill

  • The Ultimate Flip Chip - Integrated Flux/Underfill

  • Can ET Pull Us Upward?

  • Optoelectronics - Adding a Little Light to the Nano-World

  • New Generation Underfills Power the 2nd Flip Chip Revolution

  • Transforming Flip Chip into CSP with Reworkable Wafer-Level Underfill

  • High Volume, Low Cost Flip Chip Assembly on Polyester Flex

  • Flexible Circuits - The Next 100 Years

  • When Are Conductive Adhesives an Alternative to Solders?

  • Polymer Solders: The Cool Lead-free Alternative?

  • Photons Bring the Big Events

  • MEMS Packaging & Assembly Issues

  • Will MEMS Become All Pervasive?



  • Additional PowerPoint Presentation Files

  • Newest Micropackaging Concepts Including MEMS & Photonics (EtroniX 2001)

  • Ultra High-Density Magnetic Heads (IMAPS 2000)

  • MEMS Packaging Issues and Materials (IMAPS 2000)

  • Flip Chip Assembly with Conductive Adhesives (IMAPS 2000)

  • The Next Big Event - One Century - Catching the Next Wave (IMAPS Boxboro 2001)

  • Overview of New Packages, Materials & Processes (Opto-MOEMS 2001)

  • MEMS - Fab, Packaing, Assembly, & Connection (SEMICON West 2001)

  • Polymer Solders: The Cool Lead-Free Alternative (SMTA 2000)

  • MEMS Packaging & Assembly Issues (SMTAI 2000)

  • Transforming Flip Chip Back Into a CSP (Pan Pacific 1999)



  • PUBLICATIONS & PRESENTATIONS FULL REFERENCE LIST: 1969 - PRESENT




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