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TECHNICAL PAPERS AND ARTICLES:

  • -Optoelectronics_2002.pdf

  • 100 Jahre Leitterplatte_German.pdf

  • 2000Plus_Entertainment.pdf

  • 2000Plus_Healthcare.pdf

  • 2000Plus_Robots-Nov-Dec 2010.pdf

  • 3,000 Years of Photonics.pdf

  • 3-D Circuits_Have they Arrived.pdf

  • 3D Packaging 2002.pdf

  • 4Way Underfill Race_2000.pdf

  • 7000 Year Cycle.pdf

  • A Brief Three-Millenia History of Digital Wireless.pdf

  • A New Multilayer Circuit Process Based on Anisotropicity.pdf

  • A Simplified Multilayer Circuit Process.pdf

  • APEX2000-WL-Underfill.pdf

  • Adhesives-Epoxy Dispensing_2.pdf

  • Adhesives-Epoxy Dispensing_Step-by-Step.pdf

  • Advances in Packaging and Assembly Polymers.pdf

  • Alchemy of Nano_CT.pdf

  • Are Polymer Solders Real_Metal_vs_Adhesive.pdf

  • Are Polymer Solders the Answer to Lead-Free Assembly.pdf

  • Area Array Chip Carrier_SMT Package for KGD_1993.pdf

  • Area Array Packaging-2008.pdf

  • Area Bonding Conductive Adhesive Preforms.pdf

  • Assembly with Conductive Adhesives.pdf

  • Best Minimal Package.pdf

  • Book Review_Nano.pdf

  • Braselton99_RFID.pdf

  • Breaking Moore\'s Memory Law.pdf

  • Building BGAs.pdf

  • CHIP PACKAGING 2.0.pdf

  • Catching the Big Wave.pdf

  • Chip Packaging 2 0.pdf

  • Chip Scale or Flip Scale.pdf

  • CondAdhesives_2001.pdf

  • Conductive Adhesives-The Way Forward.pdf

  • Conductive Adhesives_Making the No-Lead Connection.pdf

  • Convergence.pdf

  • Conversion_Circuit Process_CircuiTree.pdf

  • Copper and PTF Merger.pdf

  • Definitive History of PCBs.pdf

  • Die Attachment for Todays Packaging Challenges.pdf

  • DiskDriveTechnology.pdf

  • ELEC_DESIGN_Mag_-MOEMS.pdf

  • ENCAPSULATION_AdvPack.pdf

  • ET Attack_2002.pdf

  • Early and Fascinating History of PCB.pdf

  • Electronic Polymers.pdf

  • Electronics Obsolete.pdf

  • Elemental_2002.pdf

  • Elements on Demand.pdf

  • Encapsulation_2004.pdf

  • Evaluating Polymer Solders for Lead-Free Assembly-Part I.pdf

  • Evaluating Polymer Solders for Lead-Free Assembly-Part II.pdf

  • Evolving Encapsulants.pdf

  • Expanding the Capability of Flexible Circuitry.pdf

  • Factoring in the Energy Factor.pdf

  • Final Revolution_2002.pdf

  • Final Revolution_2003.pdf

  • Flex History 2002.pdf

  • Flex in the Years 2000 Plus.pdf

  • Flex-Based Packages-Chip Carriers.pdf

  • Flex-Based Packaging Solutions _ CSP to MEMS.pdf

  • Flex-Based Packaging-Part 2.pdf

  • Flex-Based Packaging-Part 3.pdf

  • Flexible Printed Wiring-Versatile Connection System.pdf

  • Flip Chip & Advanced SMT Assemby with PTF_IPC.pdf

  • Flip Chip 1,2,3.pdf

  • Flip Chip Assembly with Condive Adhesives.pdf

  • Flip or Flop_Flipchip.pdf

  • FlipChip_vs_CSP_2000.pdf

  • FlipChip_w_Cond-Adh_2000.pdf

  • Future Applications for MEMS-MOEMS Technology.pdf

  • Future Directions for TAB_1987.pdf

  • Future is Plastics.pdf

  • Future of Medicine.pdf

  • GETTERS_HDI-2001.PDF

  • Getters-in Packaging.pdf

  • Gilleo 7-09 rev2.pdf

  • Gilleo0808_MEMS.pdf

  • Groove Circuits_CircuiTree.pdf

  • HDI Expo-Reworkable2.pdf

  • HDI_1999-RFID.pdf

  • History of the Printed Circuit_CH1.pdf

  • Home Grown Circuits.pdf

  • How Old is Nano Imprinting.pdf

  • IMAPS98_Great UF Race.pdf

  • IMAPS98_UltimateCSP.pdf

  • IPC-Toron_MEMS-MOEMS.pdf

  • Implementing SMT with Conductive Adhesives.pdf

  • Interpack_1999.pdf

  • Introduction to Conductive Adhesives.pdf

  • Is Electronics Obsolete.pdf

  • Is MEMS Still the Word_1.pdf

  • Joining Materials_Past Present Future_Part II.pdf

  • Joining Materials_Past Present Future_Part1.pdf

  • Lets Hear it for Groovy Circuits.pdf

  • LowBall-Pack_SemiConWest04.pdf

  • MEMS PKG ISSUES & MTLS.PDF

  • MEMS Pack Chall - 2000.pdf

  • MEMS Packaging Issues & Materials.pdf

  • MEMS Packaging Solutions.pdf

  • MEMS WLP-IWLPC05.pdf

  • MEMS pack update-09.pdf

  • MEMS_Challenges.pdf

  • MEMS_MOEMS_2001.pdf

  • MEMS_MOEMS_IMECE2000.pdf

  • MEMS_MOEMS_Photonics_2001.pdf

  • MEMS_Pack-Assem_SMTAi-2000.pdf

  • MEMS_Pack_IMAPS2000.pdf

  • MID-Circuits.pdf

  • MOEMS the WORD-2000.pdf

  • MOEMS_the_Word_2000_CA.pdf

  • Metalworking_ 21st Century.pdf

  • Molded Plas Pack_SMTAi-2004.pdf

  • Molded Underfill for Flip Chip in Package.pdf

  • Molded Underfill_2000.pdf

  • Molded-Underfill_2000.pdf

  • Molding-2005-Jones-Gilleo.pdf

  • Moores HDD Law.pdf

  • NEXT Big Event.pdf

  • NSF-MEMS_WORKSHOP.pdf

  • Nanotech_Energy_Snakeoil.pdf

  • NepWest98_Chemistry-Underfills.pdf

  • NepWest99_Wafer-level Underfill.pdf

  • Never Need Batteries EP&P.pdf

  • New Trends in Packaging_1995.pdf

  • Next Big Event_EP&P.pdf

  • Next Century of Printed Circuits_CH13.pdf

  • Next Generation Circuits.pdf

  • No Place to Go but Up.pdf

  • Non-metal conductors.pdf

  • On the Verge of Converge.pdf

  • Opto-history_IMAPS-Nordic2002.pdf

  • Opto_v_Elec_2002.pdf

  • Optoelec_RIT_2002.pdf

  • Optoelectronics_vs_Electronics.pdf

  • Organic Solders Take on New Shapes.pdf

  • PCB Classification.pdf

  • PCB History-Captives_CH11.pdf

  • PCB History-Chip Carrier_CH5.pdf

  • PCB History-Educators_CH12.pdf

  • PCB History-Eisler_CH3.pdf

  • PCB History-Flex_CH9.pdf

  • PCB History-Independents_CH6.pdf

  • PCB History-Molded_CH7.pdf

  • PCB History-Suppliers_CH8.pdf

  • PCB History_CH1.pdf

  • PCB History_Chip Carrier_CH4.pdf

  • PCB History_War_CH2.pdf

  • PCBs, Semis and Nanotech.pdf

  • POLY-SOLDER_A New Junction-Stable Conductive Adhesive.pdf

  • PTF Merges with Flexible Circuitry.pdf

  • PTF SMT and Flex-A Winning Combination.pdf

  • PTF Technology_Book.pdf

  • Package-PCB_ Classification.pdf

  • Packaging Medical Electronics.pdf

  • Packaging Problems_Flex.pdf

  • Packaging in 2001.pdf

  • PanPac 2003-Emerg-Tech.pdf

  • PanPac2001_Packaging.pdf

  • Past-Present-Future-FLEX.pdf

  • Photonics-2001_SMTA.pdf

  • Photonics_2001.pdf

  • Plastic Pack_APEX-2003.pdf

  • Plastic Pack_APEX-2005.pdf

  • Plastic Pack_IMAPS_2003.pdf

  • Plastics in Your Future.pdf

  • Podcast_Ethanol.pdf

  • Podcast_Flex-Inner-Outer.pdf

  • Polymer Bonding Systems Offer Alternatives to Soldering.pdf

  • Polymer Materials-Empowerment of Flip Chip.pdf

  • Polymer Systems for Connection-Interconnection.pdf

  • Polymer Thick Film (PTF) Circuits.pdf

  • Polymer Thick Film_PPR-96.pdf

  • Programmable Matter.pdf

  • Putting the Flex Puzzle Together.pdf

  • REWORKABLE Polymers_HDI Expo.pdf

  • RF-MEMS.pdf

  • RFID Tags Enabled by Flip Chip.pdf

  • Ready for MID.pdf

  • Roll to Roll Hybrid Circuits.pdf

  • Rheology and Surface Chemistry for Screen Printing.pdf

  • SHORT HISTORY OF FLIPPED CHIPS.pdf

  • SITE_1987_Gilleo_Printed Electronics.pdf

  • SITE_1988_Gilleo_Anisotropic Adhes.pdf

  • SITE_1988_Gilleo_Printed-thru-Hole.pdf

  • SITE_1988_Gilleo_Soldering Mylar.pdf

  • SITE_1988_Print-vs_Photo.pdf

  • SMI98_LowCost FlipChip_Flex.pdf

  • SMT Chip Carrier.pdf

  • SMT+Flex=Versatility.pdf

  • SMT-Flex-A Synergistic Solution.pdf

  • SMT_No Soldering_No Joke.pdf

  • Search for a New Device Could Catalyze PCB Revolution.pdf

  • Sheldahl.pdf

  • Solderless SMT Assembly_EXPO-SMT-1988.pdf

  • Solid Underfill_2000.pdf

  • Stacking Silicon-The Race to TSV in 3D.pdf

  • System on Package-Review.pdf

  • Technology Update_Bleeding Edge.pdf

  • Telecom Revolution.pdf

  • The Chemist in Electronics.pdf

  • The Circuit Centennial.pdf

  • The First 105Years FlexibleCircuitry.pdf

  • The First 7,000 Years Part II.pdf

  • The First 7,000 Years of Soldering - Part I.pdf

  • The Future of Packaging.pdf

  • The MEMS PCB Assembly Challenge.pdf

  • The Next Generation_Circuits.pdf

  • The Next Generation_Military.pdf

  • The Other Circuit Process.pdf

  • The Packaging Revolution_BGAs CSPs and Flip Chip.pdf

  • The Polymer Electronics Revolution_NepconWest92.pdf

  • The Real History of Chip on Flex.pdf

  • The Real Printed Electronics.pdf

  • The Real Warbots.pdf

  • The Real e-Ticket.pdf

  • The Real e-Ticket_Moving the Window.pdf

  • The Robots Have Landed.pdf

  • The Time is Right for Injection Molded Packages.pdf

  • Thermoplastic Adhesives _ Attachment Solution for Multichip Modules.pdf

  • Thinking Out of the Hermetic Box.pdf

  • Time to Give Flip Chip a Rest.pdf

  • Ultra-High-Density Heads.pdf

  • Underflip-WUF.pdf

  • Using SM Devices on Flexible Circuitry.pdf

  • Verge to Converge_2002.pdf

  • Vertical Thinking.pdf

  • Virtuality 2084.pdf

  • Wafer-Level Flip Chip_Underflip.pdf

  • Way Beyond Silicon_June2010.pdf

  • Whats Behind Flex Success.pdf

  • When Worlds Collide.pdf

  • When Worlds Collide_Bleeding Edge.pdf

  • Will Assembly Disappear.pdf

  • Worlds Best Minimal Package.pdf

  • Area Array Packaging - Then and Now

  • The Future of Technology - 50 Years Ahead

  • The Sci-Fi Future of Medicine ... the Next 50 Years

  • The Alchemy of Nanotech

  • The Alchemy of Nanotech - Part II

  • Milestones in Packaging (notes)

  • Onward and Upward - from Pyramids to Blocks

  • The Enlightened Chip

  • The Future of Packaging

  • Big Nano Success Stories

  • The Sci-Fi Future of Medicine ... the Next 50 Years

  • The Future of Technology - 50 Years Ahead

  • Thermoplastic Injection Molding: New Packages and 3D Circuits

  • Thermoplastic Electronic Packaging: Low Cost High Versatility

  • Heat Sink Materials

  • MEMS in Medicine

  • MEMS Packaging Update

  • Injection Molded & Micro Fabrication Electronic Packaging

  • Packaging Medical Electronics Products

  • Low Ball BGA: A New Concept in Thermoplastic Packaging

  • The Alchemy of Nanotechnology

  • The New Convergence

  • Time To Consider Thermoplastic Materials for Electronic Packaging

  • Underfill Update: Materials and Processes

  • Press Release: Wafer-Level Die Stacking and Assembly

  • Device/Package/PCB/System Technology Categories

  • Plastic Hermetic Packages for MEMS, MOEMS & Optoelectronic Devices?

  • Wafer-Level Flux-Underfill: Underflip!

  • MEMS & MOEMS Packaging Challenges

  • Overview of New Packages, Materials and Processes

  • RFID Tags Enabled by Flip Chip

  • The Circuit Centennial

  • Managing MOEMS

  • Newest Micropackaging Concepts Including MEMS & Photonics

  • Conductive Adhesives - The High Tech Solution in Medical Electronics

  • Flip Chip Assembly with Conductive Adhesives

  • Getters Molecular Scavengers for Packaging

  • Flex-Based Packaging Solutions from CSPs to MEMS

  • Materials and Processes for MR and GMR Heads and Assemblies

  • Ultra-High Density Magnetic Heads

  • Reworkable Packaging Materials Die Attach & Underfills

  • The Great Underfill Race

  • Will Flip Chip Become the Ultimate CSP?

  • The First 147 Years of OptoElectronics

  • MEMS Challenge: Can This Technology Catch the Internet Lightwave?

  • Interposer Multilayer Circuitry

  • Nano-Hoax?

  • The Chemistry & Physics of Underfill

  • The Ultimate Flip Chip - Integrated Flux/Underfill

  • Can ET Pull Us Upward?

  • Optoelectronics - Adding a Little Light to the Nano-World

  • New Generation Underfills Power the 2nd Flip Chip Revolution

  • Transforming Flip Chip into CSP with Reworkable Wafer-Level Underfill

  • High Volume, Low Cost Flip Chip Assembly on Polyester Flex

  • Flexible Circuits - The Next 100 Years

  • When Are Conductive Adhesives an Alternative to Solders?

  • Polymer Solders: The Cool Lead-free Alternative?

  • Photons Bring the Big Events

  • MEMS Packaging & Assembly Issues

  • Will MEMS Become All Pervasive?



  • POWERPOINT PRESENTATION FILES:

  • ET-SUMMIT-09-Gilleo.pps

  • ET-SUMMIT-09-Gilleo.ppt

  • Gilleo_MEMS-Nano10.ppt

  • Gilleo_MEMS-Nano1A.ppt

  • Gilleo_MEMS-Nano1B.ppt

  • Gilleo_MEMS-Nano2.ppt

  • Gilleo_MEMS-Nano3.ppt

  • Gilleo_MEMS-Nano4.ppt

  • Gilleo_MEMS-Nano5.ppt

  • Gilleo_MEMS-Nano7.ppt

  • Gilleo_MEMS-Nano8.ppt

  • Gilleo_MEMS-Nano9.ppt

  • SMTA ET2008.ppt

  • Newest Micropackaging Concepts Including MEMS & Photonics (EtroniX 2001)

  • Ultra High-Density Magnetic Heads (IMAPS 2000)

  • MEMS Packaging Issues and Materials (IMAPS 2000)

  • Flip Chip Assembly with Conductive Adhesives (IMAPS 2000)

  • The Next Big Event - One Century - Catching the Next Wave (IMAPS Boxboro 2001)

  • Overview of New Packages, Materials & Processes (Opto-MOEMS 2001)

  • MEMS - Fab, Packaing, Assembly, & Connection (SEMICON West 2001)

  • Polymer Solders: The Cool Lead-Free Alternative (SMTA 2000)

  • MEMS Packaging & Assembly Issues (SMTAI 2000)

  • Transforming Flip Chip Back Into a CSP (Pan Pacific 1999)



  • MISCELLANEOUS FILES:



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